Global Wafer-Level Packaging Market Outlook to 2027

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Global wafer level packaging market

Global wafer level packaging market

Global wafer level packaging market

Dublin, December 22, 2022 (GLOBE NEWSWIRE) — The “Wafer-Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity & Forecast 2022-2027” report has been added to researchandmarkets.com offering.

The global wafer-level packaging market was valued at $4.0 billion in 2021. Looking ahead, the publisher expects the market to reach $11.2 billion by 2027, exhibiting a CAGR of 18.72% during 2021-2027.

report attribute

Details

No. of pages

141

forecast period

2021 – 2027

Estimated Market Value (USD) in 2021

$4 billion

Expected Market Value (USD) by 2027

$11.2 billion

compound annual growth rate

18.7%

Regions covered

Global

Taking into account the uncertainties of COVID-19, we are continuously tracking and evaluating the direct and indirect influence of the pandemic on different end-use industries. These insights are included in the report as a major contributor to the market.

Wafer-level packaging (WLP) refers to a packaging solution used to add a protective layer to electronic connections and integrated circuits (ICs). It is used for devices such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors, and transistors.

Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer level of the device, rather than cutting the wafer into individual cubes and packaging them.

This offers several benefits, such as a reduction in the size of wafer chips, streamlining of manufacturing processes, and improvements in chip functionalities. Ultra-thin wafers also provide improved heat dissipation and performance, reduced form factor, and minimal power consumption.

The significant growth in the electronics industry worldwide represents one of the key factors creating a positive outlook in market growth. In addition, the increasing demand for more compact and faster consumer electronics is also driving the growth of the market.

This has also increased the overall demand for high-performance, cost-effective packaging solutions to improve mechanical protection, structural support, and extend battery life of devices. In addition, various technological advances, such as the integration of connected devices with the Internet of Things (IoT), act as other growth-inducing factors.

For example, WLP is widely used for manufacturing radar systems in autonomous cars. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including the increasing miniaturization of circuitry in microelectronic devices, along with extensive research and development (R&D) activities, are expected to further drive the market.

Competitive Landscape:

The competitive landscape of the industry was also examined along with the profiles of the key players, which are Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited , IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.

Key questions answered in this report:

  • How has the global wafer-level packaging market performed so far and how will it perform in the coming years?

  • What has been the impact of COVID-19 on the global wafer-level packaging market?

  • What are the key regional markets?

  • What is the division of the market according to the type of packaging?

  • What is the market division based on end-use industry?

  • What are the various stages in the industry value chain?

  • What are the major driving factors and challenges in the industry?

  • What is the structure of the global Wafer Level Packaging market and who are the key players?

  • What is the degree of competition in the industry?

Key topics covered:

1 Preface

2 Scope and Methodology

3 Executive summary

4 Introduction
4.1 Summary
4.2 Key Industry Trends

5 Global Wafer Level Packaging Market
5.1 Market Overview
5.2 Market performance
5.3 Impact of COVID-19
5.4 Market Forecast

6 Market Breakdown by Packaging Technology
6.1 3D SVT WLP
6.1.1 Market trends
6.1.2 Market Forecast
6.2 2.5D SVT WLP
6.2.1 Market trends
6.2.2 Market Forecast
6.3 WLCSP
6.3.1 Market trends
6.3.2 Market Forecast
6.4 NanoWLP
6.4.1 Market trends
6.4.2 Market Forecast
6.5 Others
6.5.1 Market trends
6.5.2 Market Forecast

7 Market Breakdown by End-Use Industry
7.1 Aerospace and Defense
7.1.1 Market trends
7.1.2 Market Forecast
7.2 Consumer electronics
7.2.1 Market trends
7.2.2 Market Forecast
7.3 IT and telecommunications
7.3.1 Market trends
7.3.2 Market Forecast
7.4 Medical care
7.4.1 Market trends
7.4.2 Market Forecast
7.5 Automotive
7.5.1 Market trends
7.5.2 Market Forecast
7.6 Others
7.6.1 Market trends
7.6.2 Market Forecast

8 Market Breakdown by Region

9 SWOT Analysis

10 Value chain analysis

11 Porter’s Five Forces Analysis

12 Price analysis

13 Competitive Landscape
13.1 Market structure
13.2 Key Players
13.3 Key Player Profiles
13.3.1 Amkor Inc. Technology
13.3.1.1 General description of the company
13.3.1.2 Product portfolio
13.3.1.3 Finance
13.3.1.4 SWOT analysis
13.3.2 China CSP Co. Ltd. Wafer Level
13.3.2.1 General description of the company
13.3.2.2 Product portfolio
13.3.2.3 SWOT analysis
13.3.3 Chipbond Technology Corporation
13.3.3.1 General description of the company
13.3.3.2 Product portfolio
13.3.3.3 SWOT Analysis
13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
13.3.4.1 General description of the company
13.3.4.2 Product portfolio
13.3.5 Fujitsu Limited
13.3.5.1 General description of the company
13.3.5.2 Product portfolio
13.3.5.3 Finance
13.3.5.4 SWOT analysis
13.3.6 IQE PLC
13.3.6.1 Company Summary
13.3.6.2 Product portfolio
13.3.6.3 SWOT Analysis
13.3.7 JCET Group Co. Ltd.
13.3.7.1 Company Summary
13.3.7.2 Product portfolio
13.3.7.3 SWOT Analysis
13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
13.3.8.1 General description of the company
13.3.8.2 Product portfolio
13.3.8.3 Finance
13.3.9 Tokyo Electron Ltd.
13.3.9.1 Company Summary
13.3.9.2 Product portfolio
13.3.9.3 Finance
13.3.9.4 SWOT Analysis
13.3.10 Toshiba Corporation
13.3.10.1 General description of the company
13.3.10.2 Product portfolio
13.3.10.3 Finance
13.3.10.4 SWOT Analysis

For more information on this report, visit https://www.researchandmarkets.com/r/7vq3qa

Attached file

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